Film-Backed Tapes
- Introduction
- Film tape utilizes high-performance polymer films (such as PET, PI, Polyimide, and PVC) as its primary carrier substrate, coated on a single or both sides with specialized adhesives (including acrylic, silicone, and rubber formulations). Because polymer films inherently possess exceptional physical properties, these tapes occupy an absolute core position across electronics assembly, industrial manufacturing, and precision processing industries.
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Product No. 9075 Thickness: 0.08 mm, Color: White, Liner: Paper, Peel Adhesion (180°): 1.00 Kgf/in, Temperature Resistance: 120°C, Features: General-purpose tape specification.
Product No. 9810T Thickness: 0.10 mm, Color: Clear, Liner: Paper, Peel Adhesion (180°): 1.94 Kgf/in, Temperature Resistance: 120°C, Features: General-purpose tape specification.
Product No. 9183T Thickness: 0.13 mm, Color: Clear, Liner: Paper, Peel Adhesion (180°): 3.39 Kgf/in, Temperature Resistance: 120°C, Features: General-purpose tape suitable for bonding foams, nameplates, and insulating materials.
Product No. 99786 Thickness: 0.14 mm, Color: Clear, Liner: Paper, Peel Adhesion (180°): 1.48 Kgf/in, Temperature Resistance: 150°C, Features: High temperature resistant non-woven double-coated tape.
Product No. 9888T Thickness: 0.15 mm, Color: Clear, Liner: Paper, Peel Adhesion (180°): 3.10 Kgf/in, Temperature Resistance: 120°C, Features: High-tack general-purpose double-coated tissue tape.
Product No. 9448HK Thickness: 0.15 mm, Color: White, Liner: Paper, Peel Adhesion (180°): 1.53 Kgf/in, Temperature Resistance: 120°C, Features: Suitable for bonding foams, rubber, and Polypropylene (PP).
Product No. 9448HKB Thickness: 0.15 mm, Color: Black, Liner: Paper, Peel Adhesion (180°): 1.53 Kgf/in, Temperature Resistance: 120°C, Features: Suitable for bonding foams, rubber, and Polypropylene (PP) with black backing.
Product No. 9448A Thickness: 0.15 mm, Color: White, Liner: Paper, Peel Adhesion (180°): 3.60 Kgf/in, Temperature Resistance: 120°C, Features: Features high tack and excellent weatherability. Ideal for nameplates and rubber bonding.
Product No. 9080HL Thickness: 0.16 mm, Color: White, Liner: Paper, Peel Adhesion (180°): 1.90 Kgf/in, Temperature Resistance: 120°C, Features: Delivers strong initial tack and high shear strength; excellent processability for die-cutt
Product No. 9077 Thickness: 0.05 mm, Color: Clear, Liner: Paper, Peel Adhesion (90°): 1.32 Kgf/in *, Temperature Resistance: 275°C, Features: Both tape and liner are capable of withstanding lead-free reflow soldering processes.
Product No. 99010LVC Thickness: 0.10 mm, Color: Clear, Liner: Paper, Peel Adhesion (180°): 1.89 Kgf/in, Temperature Resistance: 150°C, Features: Low volatility (Low VOC) design, ideal for automotive interior trims. Compliant with JAMA and VDA273 standards.
Product No. 99015LVC Thickness: 0.15 mm, Color: Clear, Liner: Paper, Peel Adhesion (180°): 3.18 Kgf/in, Temperature Resistance: 150°C, Features: Low volatility (Low VOC) design, ideal for automotive interior trims. Compliant with JAMA and VDA273 standards.
Leveraging its robust polymer architecture, film-backed tape delivers exceptional dimensional stability and high tensile strength. This not only perfectly accommodates high-precision die-cutting processes but also guarantees reliable, clean single-piece removal without residue during assembly rework. It breaks through conventional thickness barriers to achieve an ultra-thin profile while providing multi-tiered protection—including excellent high-temperature endurance, high-strength electrical insulation, and chemical corrosion resistance. Enhanced by the high optical clarity inherent in specific backings, it stands as the premier bonding solution for modern 3C devices, optical displays, and precision industrial assemblies where space is critical and high reliability is non-negotiable.
Leveraging its ultra-thin profile, exceptional thermal resistance, and suitability for precision die-cutting, film-backed tape is extensively utilized in 3C display laminations, micro-component bonding, high-temperature masking protection during PCB manufacturing, and the precision assembly of industrial and automotive electronics.